Schottky Barrier And Thin Device Analysis | Skills Pool
Skill File
Schottky Barrier And Thin Device Analysis
Solve two-carrier semiconductor models, analyze current transport in Schottky barriers, and evaluate quasi-Fermi level behavior in thin/thick devices with surface recombination. Use when performing numerical integration, analyzing device characteristics, or assessing ambipolar approximation validity.
Use this skill to solve the governing equations for two-carrier semiconductor models, analyze current transport mechanisms, and understand quasi-Fermi level behavior in Schottky barriers and thin devices with surface recombination.
When to Use
Performing numerical integration of semiconductor devices
Analyzing current flow in Schottky barriers
Evaluating quasi-Fermi level behavior in thin vs thick devices
Assessing validity of ambipolar diffusion approximation
Calculating GR currents and their contribution to total current
Analyzing devices with strong surface recombination
Two-Carrier Governing Equations
Solve this system of six first-order differential equations:
1. Electron Transport
jn = q * μn * n * F + q * Dn * (dn/dx)
Related Skills
(Drift current + Diffusion current)
2. Hole Transport
jp = q * μp * p * F - q * Dp * (dp/dx)
(Drift current - Diffusion current)
3. Electron Continuity
(1/q) * (djn/dx) = U
4. Hole Continuity
(1/q) * (djp/dx) = -U
5. Poisson Equation (Field)
dF/dx = -ρ / ε
6. Charge Density
ρ = q * (p - n + Nd - Na)
Note: Requires six boundary conditions (nb, Fb, ψb, pb, jnb, jpb). Use mixed condition approach and iteration.
Current Transport in Schottky Barriers
Main Current Calculation
jni = j = nc * e * v*
nc: electron density at interface
v*: thermal velocity parameter
Example (Ge Schottky barrier):
nc = 4.48 × 10¹³ cm⁻³
v* = 5.7 × 10⁶ cm/s
j(s) = -40.6 A/cm²
Supporting Field in Bulk
F10 = reverse saturation field
Example: F10 = 6.55 V/cm
Divergence-Free Hole Current
jpi = -μp * p10 * e * F10
Typically > 5 orders smaller than jni.
Generation-Recombination Current
Calculate by numerical integration of net rate U:
Δjgr = ∫U dx
Near electron reverse saturation: Δjgr ≈ 20 μA/cm²
6 orders smaller than jni
Increases with reverse bias (does not saturate)
Electron and hole GR currents are complementary
Quasi-Fermi Level Behavior
Thin Devices (Strong Surface Recombination)
Quasi-Fermi Level Collapse
Collapse at both boundaries: x=0 and x=d1
Near Neutral Contact
EFn: constant (n is constant)
EFp(x): decreases in reverse bias, joins EFn at x=d1
Impact on Carriers
Minority Carriers:
Substantial changes: p(x), EFp(x), jp(x)
Majority Carriers:
Essentially unchanged
Exception - DRO Range:
Condition: minority carrier density > majority dopant density
Result: slight reduction of DRO-range width
Consequence: "slight steepening of characteristics" before saturation
Thick Devices
Spatial Distribution
Quasi-Fermi levels spread beyond junction region
Join gradually as electrodes approached
Region Distinction (Higher Reverse Bias)
DRO-region (Depletion Region):
Quasi-Fermi levels and band edges slope parallel
Characterized by rapid changes
DO-region (Diffusion Only):
Band edges essentially horizontal
More gradual quasi-Fermi level changes
Carrier Density Distribution (Strong Surface Recombination)
Condition
Applies when n >> p (electron density much greater than hole density)
Hole Density p(x) Behavior
Increases in bulk region
Minimum point shifts further into bulk
Depth of minimum is reduced (not as deep)
Reason: increased diffusion current toward right surface