Soc Integration

Progress Checklist

• Step 1: Define bus fabric topology
• Step 2: Allocate memory map
• Step 3: Plan IP qualification
• Step 4: Design interrupt architecture
• Step 5: Plan DFT strategy
• Step 6: Production test readiness

Step 1: Define Bus Fabric Topology

• Select bus protocols per performance tier (AXI4 for high-bandwidth, APB for config).
• Define interconnect topology: crossbar, ring, hierarchical bridge.
• Specify arbitration policy per master (fixed priority, round-robin, weighted).
• Plan outstanding transaction support and ID width.
• Define QoS parameters for latency-sensitive paths.

Step 2: Allocate Memory Map

• Assign address ranges to each peripheral and memory region.
• Verify no address overlap and document reserved regions.
• Define secure vs non-secure address space partitioning.
• Plan boot address mapping and remapping.
• Document register map for each IP block (base address, register offsets, field definitions).

Step 3: Plan IP Qualification

• Define IP integration checklist per block: interface compliance, clock/reset, documentation.
• Verify IP protocol compliance (AMBA protocol checker assertions).
• Check clock domain requirements and CDC interfaces.
• Verify reset requirements (async/sync, reset ordering).
• Confirm silicon-proven status or required validation level.

Step 4: Design Interrupt Architecture

• Define interrupt controller topology (centralized GIC, distributed).
• Map interrupt sources to controller inputs with priority assignments.
• Specify edge vs level sensitivity per interrupt.
• Plan interrupt routing for multi-core configurations.
• Verify interrupt latency budget from source to handler.

Step 5: Plan DFT Strategy

• Define scan architecture: full scan, compressed scan (DFTMAX, EDT).
• Plan memory BIST for all embedded memories.
• Specify JTAG/boundary scan (IEEE 1149.1) implementation.
• Define ATPG fault coverage targets (stuck-at >98%, transition >95%).
• Plan test mode control and isolation.
• Define analog/mixed-signal test access (if applicable).

Step 6: Production Test Readiness

• Define production test flow: wafer sort, package test, system-level test.
• Specify test time budget per die.
• Plan for design-for-debug: trace ports, performance counters, embedded logic analyzers.
• Define die ID and fusing strategy.
• Document known-good-die (KGD) criteria.

Compaction resilience: If context was lost, re-read the Inputs section for the SoC under integration, check the Progress Checklist, then resume from the earliest incomplete step.

Output Format

Integration Status Matrix

Handoff

• Hand off to chip-design-flow for physical implementation of the integrated SoC.
• Hand off to verification-methodology for SoC-level verification planning.
• Hand off to forge/rtl-security-review for security audit of bus fabric and access controls.

Quality Checks

• Bus fabric topology defined with protocol selection justified
• Memory map complete with no address overlaps
• All IP blocks qualified against integration checklist
• Interrupt architecture documented with priorities
• DFT strategy covers scan, BIST, and ATPG targets
• Production test flow and time budget defined

Evolution Notes